A Modular Future: Chiplets, AI, and Advanced Packaging

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On this episode of Embedded Insiders, Ken sits down with Rozalia Beica, Field CTO at Rapidus Corporation, to explore the rise of chiplet integration, Rapidus' U.S. expansion, the transformative role of AI in semiconductors, and the growing importance of advanced packaging in the industry. Stay tuned for insights into how Rapidus is shaping the future of semiconductor technology.

Next, Ken discusses how customer experience centers are driving innovation in complex embedded systems.

But first, Rich and Ken highlight some important industry news involving, you guessed it, AI. They’re also sharing some information ahead of embedded world 2025

For more information, visit embeddedcomputing.com

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Next Gen Device Design & The Current State of SDVs

The Basis of Battery Systems & Hitting The Memory Wall

The AI-Powered Future of RF Design & The Evolution of Embedded Systems

MCUs for Humanoids and the Future of Embedded Apps

Edge AI Security: Why Secure-by-Design Engineering Matters

Energy Issues in Data Centers & MCUs vs. MPUs

A Deep Dive Into the Connectivity Ecosystem: Wireless Trends, Standards & Innovation

Ambient IoT, the Thread Standard, and Acquisitions in Edge AI

Building Smarter AI: The Future of Edge Architecture & Innovation

Qualcomm's Acquisition of Arduino & Bringing Down EV Costs with Hardware and Battery Innovation