The Importance of Chipscale Packaging in Electronics

AI workloads and other advanced computing applications continue to expand, pressuring the development community with the dual challenges of performance and manufacturability. Traditional SoCs are approaching their limits in terms of size, yield, and cost, and one solution lies in chiplet-based architectures. In this episode, we talk to Larry Zu, CEO at Sarcina Technology, and how the company is deploying interconnect to minimize signal crosstalk and enhance signal integrity.