Samsung Secures $200 bn Broadcom AI Chip Deal Through 2030 to Challenge TSMC in Foundry Market - TelecomLead

## Episode Summary In this episode, we cover: - **Samsung Secures $200 bn Broadcom AI Chip Deal Through 2030 to Challenge TSMC in Foundry Market - TelecomLead** (google_ai_chip) - [Read more](https://news.google.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?oc=5) - **Bain Capital's data center unit removes disgraced tenant suspected of smuggling Nvidia GPUs to China — Megaspeed previously alleged to have spent roughly $2 billion on AI processors for illicit distribution - Tom's Hardware** (google_nvidia) - [Read more](https://news.google.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?oc=5) - **AI chip boom shifts bottleneck to advanced packaging, says AT&S CEO - Nikkei Asia** (google_ai_chip) - [Read more](https://news.google.com/rss/articles/CBMiuwFBVV95cUxOZjhVV3dMWU1TWjlETXVKZE53cFp6V29nODB5X2t3cVdXZXBjcmp1UWd4cTZyRXBSUG1wZWVJRS1XcVgwR0g5UXRpNXo1dzc2N0ZTdVpmemo4Q2laY1h6RXFZUEZuQ2hoM1VONThRQi1sQjQ5LXluMU9VUVBkWmx6b3pZZkE5WnVIYmV3c0VlbUZwa0gtYmk4SGpfTk9fOFZwNDdXbExQUVFvWHpXU0p5alV4ZndoTlpVUnZz?oc=5) - **NVIDIA Blackwell Tops MLPerf Training 6.0 with Industry-Leading Scale and Performance** (nvidia_dev) - [Read more](https://developer.nvidia.com/blog/nvidia-blackwell-tops-mlperf-training-6-0-with-industry-leading-scale-and-performance/) - **Google’s ‘Frozen V2’ TPU hardwires SRAM onto silicon, ditching TSMC’s CoWoS packaging for Gemini** (wccftech) - [Read more](https://wccftech.com/googles-frozen-v2-tpu-hardwires-sram-onto-silicon-ditching-tsmcs-cowos-packaging-for-gemini/) --- *Sponsored by Ada, Ago Consulting, and Zen Semiconductor*