Compact High Speed Design with Lukas Henkel

Welcome Lukas Henkel of OV Tech GmbH, a product design firm based in Nuremburg Germany!

• Miniturization and the limits of miniturization
• Price is a constraint
• Using standard PCB tech (off the shelf)
• Open source SIP
• Steps
  • Conventional pcbs / components
  • Silicon inductors embedded in boards
  • Bonded Bare dies / stacked
• Need volume to make it work
• Requirements to fit into ______
• iMX8 ULP - 0.4mm CSP
• SIP Footprint
• Module abstraction layer talk
• Framework laptop
• Software support / BSP
• SIP will be different than PiMX8
• Crowdsupply campaign launching 2-3 weeks and delivery in Dec/Jan
• OpenSource laptop
• CM4 vs PiMX8
• SPI Flash with backup partition
• Secure element SE050
• Footprint for coral tpu and Halo 8
• Trying to solve the problem of vision use cases
• Marketing using layout / products but also making money on it
• Katerina show
• Visualizing simulations
• Developing intuition
• OpenEMS
• Usability is based on python scripting
• Using Blender for heat map
• BVTKNodes uses .vtk file output
• Multiphysics solvers
• Things that drive Lukas
• For HDI, Thinking in 3D / 2.5D and being able to visualize
• Layers ranging from 4 to 18
• Any layer design for SIP
• Wurth electroncis for high density "any layer stackup"
• Article series on altium for the open laptop
• Follow Lukas on LinkedIn